Semiconductor Packaging
Automatic High Precision Die Bonder
Product Feature
Designed for optical module/ lidar/ sensor/ SIP/ MEMS, etc., XY placement accuracy ± 3~5um@3σ
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Designed for optical module/ lidar/ sensor/ SIP/ MEMS, etc., XY placement accuracy ± 3~5um@3σ
Contact Us
Download
Shenzhen Headquarters：Building 3, Yufengda Industrial Park, Guangming District, Shenzhen City, Guangdong Province, China
Reception Service Number：0755-23019639
Consultation Email：hongbin.ding@laserx.net & laserx.xs@laserx.net
About LaserxCompany ProfileDevelopment HistoryCompany CultureHonor and Qualification
ProductsBurn-in And TesterOptical AlignmentSemiconductor PackagingChip TesterHigh precision linear and goniometer slide
SolutionOne-stop Solution for Photonic PackagingPhotonic Assembly and AlignmentIndustrial Laser Burn-in And TesterAdvanced packaging
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