• 10 burn-in power units, support up to max 5120 COC
• 4 burn-in cassettes supported by each power unit, each burn-in cassette can be independently controlled
• Burn-in cassette can be loaded offline
• Burn-in temperature 50~150℃ adjustable

• Automatic magazine loading, 20-COC fish bone fixtures, accomoding a total of 640 COC
• The 32-COC fixture is suitable for both burn-in machine and wire bonder
• Dual platform design, save load/unload and pre-heat time
• TEC temperature control(20~100℃) to meet the temperature accuracy and stability
• LlV and spectrum test
• Support the backlight optical power test

• 20 burn-in power units, support up to 640 COS (might be affected by COS power rating)
• 2 burn-in cassettes supported by each power unit, burn-in cassette can be loaded offline
• Support in-sute optical power monitoring
• Support pump and industrial laser COS

• Fully enclosed design, the test ambient temperature -10~100℃ adjustable
• Support LIV, PER, optical spectrum, and far-field test
• Support pump and industrial laser COS
• Test fixture shared with burn-in machine

• High capacity, support up to 384 channels
• Support for CW and QCW mode operation
• The faulty product can be powered off individually
• In-sute optical power, temperature and voltage monitoring for individual channels
• Optical port reserved for wavelength measurement for chip junction temperature calibration
• Alarm and warning mechanism to ensure the safety operation

• Test LlV, optical spectrum, far field, polarization extinction ratio
• Automatic OCR chip/substrate lD for data binding
• Load/unload flexibly configured with waffle pack, Gel-pack and B/l fixture
• Dual test platforms for parallel test to increase UPH significantly
• Development is in progress to integrate AOl feature for defect detection