Founded in 2017 by experienced engineers in photonics and automation, Laserx serves the semiconductor, industrial laser, and optical communication markets with standard and customized photonic packaging equipment. Our products cover key processes inlcuding burn-in/testing, precision assembly and activce alignment. Thanks to our high-precision machining capabilities, we can response to our customer's needs with high-quality and quick delivery.

Laserx offers comprehensive solutions for die attachment and active alignment, capable of meeting the mass production needs for high-speed optical modules of 400G, 800G, and 1.6T.

Laserx offers high-power burn-in equipment with for high precision and extended reliability. These systems are engineered with scalability in mind, making them ideal for both research and development as well as mass production.

Laserx offers D/B and W/B equipment, with for high precision, high degree of automation, core technology is self-controlled, high cost-effectiveness. And we currently developing advanced 2.5D/3D packaging solutions for photonic devices.