Passive/active high precision positioning are the crucial for photonic device assembly, where Laser X provides comprehensive solutions for die attachment and active alignment.
Laser X die bonder features high accuracy (3um@3sigma), high speed (<3s/pcs) and exceptional reliability, making it perfect for different types of photonic sub-assembly and module manufacturing, including BOX, COB, TO etc.
By collaborating closely with our customers, Laser X focus on providing off-the-shelf and customized active alignment solutions to meet the different requirements, ranging from cost sensitive, highly efficient short reach (SR) systems to complex and highly reliable ones for coherent applications. Our in-house high precision machining capability allows us to design customized fixtures (like collet, gripper etc.) with quick turnaround time.
Laser X aligners are equipped with high-definition cameras and confocal height detectors for initial position and tilt management, thereby significantly reducing alignment cycle time and enhancing process yield. The precision motion system can be configured to adapte customer device designs with various optical systems including:
- Plastic lens block (SR),
- Single/dual lenses for EML/DML,
- PIC/FA.
With the rising demand for SiP applications targeting the high-speed, high-density 400G/800Gbps market, we have developed active aligners for transceiver optical systems featuring both single/double lens and FA designs. Successful alignment requires nanoscale precisioning over multiple channels simultaneously, presenting challenges for both hardware and software development. Over the past four years, Laser X aligners have been developed and supplied to multiple customers for SiP-based transceiver manufacturing, proving to be a robust and reliable solution for mass production.
Our dual lens aligner is equipped with dual 6-axis precision stages (<50nm). Utilizing machine vision and accurate height measurement, Laser X's proprietary software employs synchronized optimization algorithms for collimating and focusing lenses. This significantly enhances alignment efficiency, achieving throughput rates of approximately 10 minutes per unit.
Our dual fiber array (FA) aligner is engineered as a standardized platform for SiP device assembly. Gap control between FA and PIC chips has been one of the main challenges for SiP device assembly since the air gap (before applying index matching epoxy) typically needs to be <2um. Laser X has achieved this through the development of a proprietary procedure in our software on standard platform, eliminating the need for expensive sensors. The aligner’s throughput can reach about 7 minutes per unit, significantly helping our customers in saving costs on capital investment.
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