Founded in 2017 by experienced engineers in photonics and automation, Laser X serves the semiconductor, industrial laser, and optical communication markets with standard and customized photonic packaging equipment. Our products cover key processes inlcuding burn-in/testing, precision assembly and activce alignment. Thanks to our high-precision machining capabilities, we can response to our customer's needs with high-quality and quick delivery.
Laser X offers over 20 categories and 40 models of equipment to meet assembly and testing needs from wafer to module. Our expertise and broad portfolio enable us providing one-stop solution for photonic packaging.
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